INQUIRYHow to enhance the anti-static ESD function of PCB board
Release time:2024-08-30
Use multi-layer PCB as much as possible. Compared with double-sided PCB, ground plane and power plane, as well as closely arranged signal line-ground spacing can reduce common mode impedance and inductive coupling to 1/10 to 1/100 of double-sided PCB. Try to place each signal layer close to a power or ground layer. For high-density PCBs with components on both the top and bottom surfaces, very short connecting lines, and many filled grounds, consider using inner lines. For double-sided PCBs, tightly interwoven power and ground grids are used. The power line is close to the ground line, and between the vertical and horizontal lines or fill areas, connect as much as possible. The grid size on one side is less than or equal to 60mm, and if possible, the grid size should be less than 13mm.
Make sure every circuit is as compact as possible. Put all connectors aside as much as possible.
Lead the power cord from the center of the card and away from areas that are directly affected by ESD. On all PCB layers below the connector leading to the outside of the chassis (easily hit directly by ESD), a wide chassis ground or a polygon-filled ground should be placed and connected together with vias at intervals of about 13mm.
Place mounting holes on the edge of the card, and connect to the chassis ground with solder-free top and bottom pads around the mounting holes.
During PCB assembly, do not coat any solder on the top or bottom pads. Screws with embedded washers are used to achieve close contact of the PCB with the metal chassis/shield or bracket on the ground plane. The same "isolation zone" should be provided between the chassis ground and the circuit ground on each floor; if possible, keep the separation distance 0.64mm.
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