INQUIRY
Quality Assurance
Never let a fake flow to the customer
Anxin has set up professional quality control centers in Shenzhen and Hong Kong, covering an area of more than 2100 square meters, equipped with 200 fully functional testing equipment, and gathered a senior professional quality testing team in the industry, which operates according to the international standard quality management system. We adhere to the quality promise of "never let a fake product flow to customers", through comprehensive quality management and professional testing process, committed to the customer's components supply chain security escort.
Covering an area of more than 2100 square meters
200 a wide range of laboratory equipment
Professional Quality Inspection Team
Foxconn Strategic Cooperation
ISO9001 qualification certification
ISO14001 qualification certification
four major advantages
Reliable
•Preliminary inspection, review and final review
•100 percent stop junk, fake and refurb
Efficient
•The fastest 2 hour to complete the detection process
•The fastest 1 hours to get the test report
Compliance
•According to ISO9001、ISO27001、ISO14001、AS9120 management system operation
Professional
•Professional Quality Inspection Team
•200 professional testing instruments
Level 4 detection
Level 1-
Label Validation
Level II-
Ontology appearance, silk screen inspection
Level 3-
Function, reliability test
Level 4-
subcontracting inspection
Typical function and reliability test items
Open-Top Inspection
The wafer is completely removed, its surface markings and manufacturer information are verified, and, in conjunction with relevant traceability data, it is further determined whether the product is genuine.
Inspur server
Supports DDR5 and DDR4 memory, next-generation PCIe 5.0 devices, and testing of CPUs, memory modules, motherboards, hard drives, network cards, RAID cards, power supplies, fans, and PCIe expansion cards.
Impedance analysis test
Measure the impedance of the device and compare it with the nominal value specified in the datasheet to verify compliance with the allowable tolerance.
X-ray nondestructive radiographic inspection
Using X-ray real-time imaging technology, non-destructive inspection is performed on structural features such as chip lead frames, chip dimensions, gold wire bonding morphology, ESD damage, and internal voids.
Programmable Device Programming and Verification Testing
Perform blank checks, read operations, programming, verification, erasure, and erase‑verification tests on the MCU to confirm that the chip is in its factory‑default configuration and has not been reprogrammed.
Solderability Test
In accordance with the IPC J-STD-002 standard, the solderability of chip leads is verified to assess whether their tinning capability under specified conditions meets the required specifications.
Anxinyi Electronic Commerce (Shenzhen) Co., Ltd.
Floor 34, AVIC Center, Huafu Road, Huaqiangbei Street, Futian District, Shenzhen
